Use in parallel to the laser!
The main features of the Kiss-Cut Module are low weight and minimal stroke, guaranteeing maximum processing speeds. In addition, this module excels in ease of use, quick tool changes, and high precision. Depending on the application, you have the option to choose between two processing modes: In pressure mode, the module exerts constant, user-definable pressure (between 30 and 1600 grams) on the substrate. The top layer of pressure-sensitive materials is cut cleanly and accurately, without damage to the liner. In position mode, the tool through-cuts the material to a set depth. The Kiss-Cut Module accommodates the universal cutting tool, a cutting tool with integrated, height-adjustable glide shoe, and a drawing/plotting tool.